Key Features

i-Falke 200 series Pre-Sawn Wafer

  • 6” and 8” wafer (without conversion) and 12” handling
  • Macro and Micro defect inspection
  • Visible light and SWIR/NIR Vision inspection solution
  • Single or dual 6 axis wafer handling robot with wafer flip capability
  • Build in wafer pre-aligner

i-Falke 200 series Post-Sawn Wafer

  • 8” and 12” wafer ring handling
  • Mechanical and stealth dicing inspection (Kerf width measurement & mech dicing defects)
  • High UPH, “on the fly” inspection
  • Bright field and dark field inspection, back light inspection