Key Features

  • Support 6”, 8” and 12” wafer in ring
  • High resolution 8MP and 16MP line scan camera to yield high precision and throughput
  • Build in smart wrong pick die detection and algorithm
  • Support wafer post sawn saw strip defect inspection
  • High IPH & throughput (Over 180 wafers per hours)
  • TCP/IP and SECS GEM enable
  • Dual load port design, support both 6” and 8” cassette wafer with common end robot wafer handling effector
  • High precision wafer robot handling up to 2mm and wafer flip capability
  • Build in wafer pre-aligner and wafer ID reader
  • 1.3MP Vision system (SWIR) to obtain high precision silicon penetration defect inspection and measurement
  • TCP/IP and SECS GEM enable